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    Advanced Packaging Market Report

    Advanced Packaging Market Report
    Report code - SR1870 Delivery - 2 Weeks
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    Advanced Packaging Market Size, Share, Trend, Forecast, Competitive Analysis, and Growth O See more...

    Market Insights

    Advanced packaging is the process of aggregating and interconnecting chips prior to traditional electronic packaging. It allows multiple devices, which include mechanical, electrical, or semiconductor devices, to be merged and packaged as a single electronic device. Connection of chips facilitates increased speed of electronic signals and reduced amount of energy required to drive them.

    Adavanced Packaging Market – Snapshot

    Forecast Period

    2022-2027

    CAGR

    7.8%

    Major Packaging Type

    Flip-Chip

    Major Application Type

    Consumer Electronics

    Region with the highest demand

    Asia-Pacific

    Key Players

    Amkor Technology, Inc., ASE Group, JCET Group Co. Ltd., Powertech Technology Inc., Sanmina Corporation, Chipbond Technology Corporation, ChipMOS Technologies Inc., UTAC, Greatek Electronics Inc., and Siliconware Precision Industries Co. Ltd.

     

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    The advanced packaging market faced a decline due to the wrath of the pandemic, which led to temporary shutdowns in various fabrication facilities, dearth of fab operators and engineers, shortage of raw materials, and difficulties in maintenance of test operations. Furthermore, reduction in production capacity of consumer electronics, automotive, and other industries resulted in decreased demand for advanced packaging.

    Major factors such as growing demand for advanced and miniaturized semiconductor components in consumer electronics, penetration of 5G technology, and increasing utilization of Internet of Things (IoT) and connected technology across the world are expected to drive the growth of the market for advanced packaging over the coming years. In addition, governments are also promoting the adoption and utilization of IoT technologies. The transition toward More than Moore’s approach, along with continual change in nodes and wafer size, is supporting the adoption of advanced packaging in foundries. Overall, the advanced packaging market is expected to grow at a promising CAGR of 7.8% during the forecast period.

    Market Segments' Analysis

    Based on the packaging type, the market is segmented as flip-chip, fan-in WLP, embedded-die, fan-out, and 2.5D/3D. The flip-chip segment is expected to remain the most utilized packaging type during the forecast period. The growth of the segment is driven by the increasing adoption of compact semiconductor components, which are used in high-performance applications, such as automotive and aerospace & defense. Flip-chip advanced packaging offers a small footprint along with a high input/output density.

    Based on the application type, the market is segmented as consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. Among these application types, the consumer electronics segment is estimated to remain the biggest demand generator for advanced packaging during the forecast period. Advanced packaging is in high demand for smartphones and smartwatches as it provides multi-function integration, improved reliability, increased chip connectivity, and reduced packaging size. Furthermore, the growing trend of compact devices would contribute to the segment's significant growth in the coming years.

    In terms of regions, Asia-Pacific is expected to remain the largest market for advanced packaging over the forecast period. The region's major countries, such as China, Taiwan, and South Korea, are increasing their production of semiconductor components and consumer electronic gadgets, which is increasing the region's share of the global market. The region also includes some of the major foundry providers, such as Global Foundries, UMC, and TSMC, among others, fast-tracking market expansion opportunities. North America and Europe are also expected to offer substantial growth opportunities during the forecast period.

    Key Players

    Most of the companies are leveraging their innovation capabilities to gain competitive advantage in the market. The following are some of the key players in the advanced packaging market:

    • Amkor Technology, Inc.
    • ASE Group
    • JCET Group Co. Ltd.
    • Powertech Technology Inc.
    • Sanmina Corporation
    • Chipbond Technology Corporation
    • ChipMOS Technologies Inc.
    • UTAC
    • Greatek Electronics Inc.
    • Siliconware Precision Industries Co. Ltd.

    Research Methodology

    This strategic assessment report, from Stratview Research, provides a comprehensive analysis that reflects today’s advanced packaging market realities and future market possibilities for the forecast period of 2022 to 2027. The report segments and analyzes the market in the most detailed manner in order to provide a panoramic view of the market. The vital data/information provided in the report can play a crucial role for the market participants as well as investors in the identification of the low-hanging fruits available in the market as well as to formulate the growth strategies to expedite their growth process.

    This report offers high-quality insights and is the outcome of a detailed research methodology comprising extensive secondary research, rigorous primary interviews with industry stakeholders, and validation and triangulation with Stratview Research’s internal database and statistical tools. More than 1,000 authenticated secondary sources, such as company annual reports, fact books, press releases, journals, investor presentations, white papers, patents, and articles, have been leveraged to gather the data. We conducted more than 15 detailed primary interviews with the market players across the value chain in all four regions and industry experts to obtain both qualitative and quantitative insights.

    Report Features

    This report provides market intelligence in the most comprehensive way. The report structure has been kept such that it offers maximum business value. It provides critical insights into the market dynamics and will enable strategic decision making for the existing market players as well as those willing to enter the market. The following are the key features of the report:

    • Market structure: Overview, industry life cycle analysis, supply chain analysis.
    • Market environment analysis: Growth drivers and constraints, Porter’s five forces analysis, SWOT analysis.
    • Market trend and forecast analysis.
    • Market segment trend and forecast.
    • Competitive landscape and dynamics: Market share, Product Portfolio, New Product Launches, etc.
    • Attractive market segments and associated growth opportunities.
    • Emerging trends.
    • Strategic growth opportunities for the existing and new players.
    • Key success factors.

    The advanced packaging market is segmented into the following categories:

    Advanced Packaging Market, by Packaging Type

    • Flip-Chip (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Fan-in WLP (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Embedded-die (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Fan-out (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • 2.5D/3D (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)

    Advanced Packaging Market, by Application Type

    • Consumer Electronics (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Automotive (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Industrial (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Healthcare (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Aerospace & Defense (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)
    • Others (Regional Analysis: North America, Europe, Asia-Pacific, and Rest of the World)

    Advanced Packaging Market, by Region

    • North America (Country Analysis: The USA, Canada, and Mexico)
    • Europe (Country Analysis: Germany, France, The UK, Russia, Italy, and Rest of Europe)
    • Asia-Pacific (Country Analysis: China, Japan, India, South Korea, and Rest of Asia-Pacific)
    • Rest of the World (Country Analysis: Brazil, Argentina, and Others)

    Report Customization Options

    With this detailed report, Stratview Research offers one of the following free customization options to our respectable clients:

    Company Profiling

    • Detailed profiling of additional market players (up to three players)
    • SWOT analysis of key players (up to three players)

    Competitive Benchmarking

    • Benchmarking of key players on the following parameters: product portfolio, geographical reach, regional presence, and strategic alliances

    Custom Research: Stratview research offers custom research services across the sectors. In case of any custom research requirement related to market assessment, competitive benchmarking, sourcing and procurement, target screening, and others, please send your inquiry to sales@Stratviewresearch.com

    Frequently Asked Questions (FAQs)

    The advanced packaging market is estimated to grow at a healthy CAGR of 7.8% over the next five years. Increasing demand for advanced and miniaturized semiconductor components in consumer electronics, penetration of 5G technology, increasing adoption of IoT and AI technology, are expected to drive the growth of the market in the coming five years.

    Amkor Technology, Inc., ASE Group, JCET Group Co. Ltd., Powertech Technology Inc., Sanmina Corporation, Chipbond Technology Corporation, ChipMOS Technologies Inc., UTAC, Greatek Electronics Inc., and Siliconware Precision Industries Co. Ltd. are some of the key players in the market.

    Asia-Pacific is estimated to remain the dominant region in the advanced packaging market in the coming years. Increasing production of semiconductor components and consumer electronic devices in China, Taiwan, and South Korea would drive the overall regions market dynamics.

    Consumer electronics application is likely to maintain its dominance in the market in the next five years on account of the increasing trend of compact electronic devices.