Aircraft Enclosures Market
This report on enclosures for the aircraft industry, from Stratview Research, is the first of its kind and features deep-dive analysis and market insights on various segments and competitive landscapes with an aim to provide market stakeholders the most well-versed resource for effective decision making as well as building profitable strategies. The report also provides complete analysis on composite enclosures, a niche but fast-growing product, to make the market participants aware about the changing material dynamics to protect their business in long run. The report provides detailed 11-year analysis for various market segments with the trend period of 2013 to 2018 and the forecast period of 2019 to 2024 at global as well as regional levels.
Enclosures in an aircraft are the cases or cabinets used to protect critical electronic components. Reduction in thermal loads, protection against aircraft fluids, protection from environment, and shielding against EMI as well as static electricity are some of the essential functions performed by enclosures of an aircraft. Over the period, there has been a drastic transformation in the design, material, as well as the size of enclosures used in the aircraft industry. The major players have been developing advanced lightweight enclosures in order to assist airframers in achieving their goal of developing fuel-efficient aircraft.
The aircraft enclosures market is projected to grow at a healthy rate over the next five years to reach US$ 1,425.3 million in 2024. Organic growth of the aircraft production to support the rising passenger and freight traffic, increasing demand for lightweight enclosures, increasing use of avionics in the next-generation aircraft, and advancement in aircraft electronics are some of the key factors that are proliferating the demand for enclosures in the aircraft industry.
The aircraft industry has always been looking for different ways to reduce carbon emissions and to improve fuel economy. Among many ways, one of the important steps is increasing use of Integrated Modular Avionics (IMA) systems to eliminate discrete Line Replaceable Units (LRUs). This step reduces the weight by paring down the number of parts required for processor units. Also, the industry has been developing more compact-sized and lightweight enclosures. For instance, the MiniMRP avionic systems developed by TE Connectivity, replace the big boxes in the avionics bay with many small boxes distributed throughout the aircraft. Additionally, it gives more computing power into 40% smaller packages at a lower cost and also helps to meet SWaP (Size, Weight, and Power).
The market is segmented based on the aircraft type as Commercial Aircraft, Regional Aircraft, Military Aircraft, and Others. Commercial aircraft is likely to remain the growth engine of the market during the forecast period. Increasing production rates of the key aircraft programs, increasing preference of composite enclosures, high focus on passenger safety, and increasing use of avionics are some key factors, which are likely to aid growth to the segment’s demand for enclosures in the coming years.
Based on the application type, the market is segmented as Avionics, In-Flight Entertainment, Embedded Computing, and Others. The avionics segment is likely to remain the most dominant application type in the aircraft enclosures market over the next five years. Airlines are increasingly seeking to refurbish aging fleets, with a sharp focus on greater fuel economies, reducing CO2 emissions, newer navigation equipment, and flight management systems enabled for connectivity. Development in avionics subsystems such as the enhanced vision system (EVS), automatic dependent surveillance-broadcast (ADS-B), attitude heading reference system (AHRS) and automated flight control can be one the reason to drive the aircraft enclosures market.
Based on the material type, the market is bifurcated into Aluminum Enclosures, Composite Enclosures, and Other Enclosures. Aluminum enclosure is estimated to maintain its dominance in the market in the foreseen future, owing to its superior mechanical, thermal, and electrical properties. However, composite enclosure is set to grow at the highest rate over the same period. Composite enclosure brings several advantages to the table including lightweight, durable, and ability to mold in complex shapes. Composite enclosures can be easily customized with shielding, circuit traces, embedded antennas, and other components.
Based on the process type, the market is segmented into Stamping, Injection Molding, and Others. Stamping is estimated to remain the most dominant manufacturing process for the construction of metal enclosures during the forecast period. The process offers several advantages including faster part cycle time and reduced defects, which lead to the overall lower production cost. Monitoring temperature during the stamping process offers additional advantages including improvement in parts quality and process consistency.
Injection molding process is likely to grow at the highest CAGR over the next five years. Composite enclosures are predominantly manufactured with high-temperature moldable thermoplastic resins, such as PPS and PEEK, which are preferably processed with the injection molding process.
In terms of region, North America is set to remain the largest market during the forecast period. The USA is the growth engine of the North American aircraft enclosures market. Presence of major aircraft manufacturers and tier players primarily drive the demand for enclosures in the country. The country is not only the largest market in North America, but it is also the largest market in the world. Asia-Pacific is likely to depict the highest growth during the same period, driven by China, India, and Japan. All these three countries would remain the growth engines of the region’s market for aircraft enclosure over the next five years.
The supply chain of this market comprises raw material suppliers, enclosure manufacturers, system suppliers, aircraft OEMs, airlines, aircraft leasing companies, and MRO companies. The key aircraft enclosure manufacturing companies are Carlisle Interconnect Technologies Inc., Garmin Ltd., Collins Aerospace, Ducommun Incorporated, Honeywell International Inc., Thales S.A., and TE Connectivity. Development of lightweight, compact size enclosures and collaboration with OEMs and system suppliers for the joint development of enclosure are some of the strategies adopted by the major players in order to gain a competitive edge in the market.
This report offers high-quality insights and is the outcome of detailed research methodology comprising extensive secondary research, rigorous primary interviews with industry stakeholders and validation and triangulation with Stratview Research’s internal database and statistical tools. More than 700 authenticated secondary sources, such as company annual reports, fact book, press release, journals, investor presentation, white papers, patents, and articles, have been leveraged to gather the data. We conducted more than 15 detailed primary interviews with the market players across the value chain in all four regions and industry experts to obtain both qualitative and quantitative insights.
This report provides market intelligence in the most comprehensive way. The report structure has been kept such that it offers maximum business value. It provides critical insights into the market dynamics and will enable strategic decision making for the existing market players as well as those willing to enter the market. The following are the key features of the report:
The global aircraft enclosures market is segmented into the following categories:
Aircraft Enclosures Market, By Aircraft Type
Aircraft Enclosures Market, By Material Type
Aircraft Enclosures Market, By Application Type
Aircraft Enclosures Market, By Process Type
Aircraft Enclosures Market, By Region
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